What does DONDODEM mean?
DONDODEM means Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators
This acronym/slang usually belongs to Undefined category.
What is the abbreviation for Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators?
Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators can be abbreviated as DONDODEM
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Most popular questions people look for before coming to this page
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What does DONDODEM stand for? DONDODEM stands for "Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators". |
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How to abbreviate "Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators"? "Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators" can be abbreviated as DONDODEM. |
| Q: A: |
What is the meaning of DONDODEM abbreviation? The meaning of DONDODEM abbreviation is "Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators". |
| Q: A: |
What is DONDODEM abbreviation? One of the definitions of DONDODEM is "Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators". |
| Q: A: |
What does DONDODEM mean? DONDODEM as abbreviation means "Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators". |
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What is shorthand of Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators? The most common shorthand of "Development of new Dielectric and Optical materials and process-technologies for low cost electrical and/or Optical packaging and testing of precompetitive Demonstrators" is DONDODEM. |
Abbreviations or Slang with similar meaning
- SIMPLE - Satellite Interactive Multimedia Platform for Low-cost Earth Stations
- ANAIS - Development of Hybrid Moulding Technologies for continuous fibre and self-reinforced thermoplastic materials
- BIDES - Development of a new vocational training structurefor the Business Interpretation education, especially emphazising the Development and testing of a new Educational Strategy for adults with a multi-cu
- CLCP - Center for Low Cost Psychotherapy
- COMPOSITEFOAM - Development of a low cost process for the manufacture of storage and pressure vessels using novel COMPOSITE thermoplastic materials
- CORETECH - Development of COst-effective REclamation TECHnologies for domestic wastewater and the appropriate agricultural use of the treated effluent under (semi-) arid climate conditions
- COLD WSPS - Development of low-cost methods for treatment and reuse of drainage and urban wastewater by adaptation of Waste Stabilitation Ponds for extreme continental climates
- DATOT - Development And Testing Of Telematic modules and vocational training measures for convicts in the open or closed penitary system
- DIALASE - Development of a novel, LASEr based manufacturing process for the production of reduced cost, enhanced performance single point DIAmond tipped cutting tools
- DOLMET - Development Of Low-cost Metallization for silicon solar cells
- EUCOTOOLING - Development of new Cutting materials, Tools, machine Concepts and Technologies for dry high speed cutting
- HI-RECIPRI - Development of a high-resolution printing process for cost-effective production of ultra-fine line electronic circuitry
- INPROWARM - Development of low cost modular dwelling components based on the combined use of WAste Raw Material and INnovative Polymeric foRmulatiOn
- LOCOP - Low-Cost Packaging for future multichip solutions
- MICROCAP - Microencapsulation for low Cost, high volume, Pharmaceutical Applications
- MITTI - Development and Testing of Modules and materials for the International qualification of Trainers and Teachers at vocational Institutions
- PLC - Platforms for Low Cost
- REFILL - Development of novel processing for the production of low-cost by-product Fillers as a replacement for high-cost primary Fillers
- ULTRAPLATE - ULTRAsonic PLAting TEchnique for low cost, clean, high-speed, high precision plating for electronic components and microsystems
- ZEOGYP-BOARD - Retrofitting existing plants for low cost production of high performance building BOARDs