What does LOCOP mean?
LOCOP means Low-Cost Packaging for future multichip solutions
This acronym/slang usually belongs to Undefined category.
What is the abbreviation for Low-Cost Packaging for future multichip solutions?
Low-Cost Packaging for future multichip solutions can be abbreviated as LOCOP
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Most popular questions people look for before coming to this page
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What does LOCOP stand for? LOCOP stands for "Low-Cost Packaging for future multichip solutions". |
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How to abbreviate "Low-Cost Packaging for future multichip solutions"? "Low-Cost Packaging for future multichip solutions" can be abbreviated as LOCOP. |
| Q: A: |
What is the meaning of LOCOP abbreviation? The meaning of LOCOP abbreviation is "Low-Cost Packaging for future multichip solutions". |
| Q: A: |
What is LOCOP abbreviation? One of the definitions of LOCOP is "Low-Cost Packaging for future multichip solutions". |
| Q: A: |
What does LOCOP mean? LOCOP as abbreviation means "Low-Cost Packaging for future multichip solutions". |
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What is shorthand of Low-Cost Packaging for future multichip solutions? The most common shorthand of "Low-Cost Packaging for future multichip solutions" is LOCOP. |
Abbreviations or Slang with similar meaning
- CHIP-SHOP - Low-Cost IC Prototyping Services for European SMEs
- CHIPPAC - Cost-Effective High-Performance Packaging for Electronic Systems
- L-CHEAPO - Low-Cost Hardware for Earth Applications and Physical Oceanography
- LADIR - Low-Cost Arrays for Detection of Infrared
- FMS - Future Memory Solutions
- LCLO - Low Cost Low Observable
- LCLA - Low Cost Low Altitude
- PTIS - Packaging and Technology Integrated Solutions
- COMPOSITEFOAM - Development of a low cost process for the manufacture of storage and pressure vessels using novel COMPOSITE thermoplastic materials
- COLD WSPS - Development of low-cost methods for treatment and reuse of drainage and urban wastewater by adaptation of Waste Stabilitation Ponds for extreme continental climates
- DOLMET - Development Of Low-cost Metallization for silicon solar cells
- FAS - Future Audio Solutions
- FCSI - Future Computing Solutions Inc
- LCLMT - Low Cost Low Maintenance Technology
- LDS - Low Dimensionality Structures for future quantum semiconductor devices
- MEOPEC - Low cost precision Micro-Engineered Components for microelectronic applications
- PLASTRONIX - Low-cost All-polymer Integrated circuits for low-end high-volume Identification Applications
- Laws - Low-Cost Arrays for Warning Sensors
- LIFT - Low-cost Initiative for First Time
- LCTC - Low-Cost Tooling for Composites (Boeing)