What does TIOM mean?
TIOM means Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems
This acronym/slang usually belongs to Medical & Science category.
What is the abbreviation for Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems?
Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems can be abbreviated as TIOM
|
|
Most popular questions people look for before coming to this page
| Q: A: |
What does TIOM stand for? TIOM stands for "Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems". |
| Q: A: |
How to abbreviate "Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems"? "Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems" can be abbreviated as TIOM. |
| Q: A: |
What is the meaning of TIOM abbreviation? The meaning of TIOM abbreviation is "Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems". |
| Q: A: |
What is TIOM abbreviation? One of the definitions of TIOM is "Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems". |
| Q: A: |
What does TIOM mean? TIOM as abbreviation means "Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems". |
| Q: A: |
What is shorthand of Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems? The most common shorthand of "Trough-wafer connection for Integrated Optic devices for improved assembly and packaging to manufacture Microsystems" is TIOM. |
Abbreviations or Slang with similar meaning
- CAMPmode - Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics
- CEOOR - Centre for Equal Opportunities and Opposition to Racism
- DGACM - Department for General Assembly and Conference Management
- SEEDIE - Society for Exorbitantly Expensive and Difficult to Implement EHR
- CAPPS - Center for Advanced Processing and Packaging Studies
- CIESE - Center for Improved Engineering and Science Education
- CISE - Center for Improved Engineering and Science Education
- IMSI - Integrated use of new Microwave Satellite data for Improved ice mapping
- AFPPPI - Arab Federation for Paper Printing and Packaging Industries
- AMENIDAD - Anisotropic Metal Nanoparticles for Improved Dielectric And optical Devices
- APEC - Escherichia coli pathogenic for poultry: molecular Approaches for improved diagnostic and Control
- CAPPS - Center for Aseptic Processing and Packaging Studies
- CHIP - Consortium for Hyper Integration and Packaging
- CMAP - Centre for Microelectronics Assembly and Packaging
- IMPCHRESS - Development of European specifications for Improved Infant and Child Restraint devices (air transport)
- LISCOS - Improved cancer risk quantification for environmental, medical and occupational exposures to low doses of ionising radiation by mechanistic models.
- NUTRIPEA - New technologies for improved Nutritional and functional value of Pea protein
- TRANSFRUIT - Integrated packaging and transport systems for fresh fruit and vegetables market
- AAPT - Advanced Assembly and Packaging Technology
- spca - Society for the Prevention and Cruelty to Animals