AA |
Antenna Array |
|
aa |
Automatic Acknowledge |
|
ABS |
Acrylonitrile, Butadiene, and Styrene |
|
AC |
Alternating Current |
|
ac |
All Call |
|
ACA |
Anisotropically Conductive Adhesive |
|
ACC |
Advanced Concept Construction Active Control Channel |
|
ACCU |
Alternating Current Connection Unit |
|
AEC |
Architecture, Engineering, Construction |
|
AGC |
Automatic Gain Control |
|
AGR |
Annual Average Growth Rate |
|
AGV |
Automated Guided Vehicle |
|
AIS |
Adhesive Interconnect System |
|
ANOVA |
Analysis of Variance (statistics) |
|
ANSI |
American National Standards Institute, Inc. |
|
AOI |
Automated Optical Inspection |
|
AOQ |
Average Outgoing Quality |
|
APT |
Automatically Programmed Tools |
|
AQL |
Acceptable Quality Level |
|
ARINC |
Aeronautical Radio Incorporated |
|
ASCII |
American National Standard Code for Information Interchange |
|
ASME |
American Society of Mechanical Engineers |
|
ASPARC |
Ability of Solder Paste to Retain Components |
|
ASQ |
Alpha System Qualification |
|
ASTM |
American Society for Testing and Materials (Philadelphia, Pennsylvania) |
|
ATG |
Automatic Test Generation |
|
ATR |
Air Transport Rack |
|
AVT |
Accelerated Vesication Test |
|
AWG |
American Wire Gauge |
|
AXI |
Automated X-Ray Inspection |
|
BC |
Buried Capacitance |
|
BDMA |
Benzyldimethylamine |
|
BGA |
Ball Grid Array [electronic Packaging] |
|
BITE |
Built-In Test Equipment |
|
BOD |
Biochemical Oxygen Demand |
|
BOM |
Bill of Material |
|
BOT |
Build To Order |
|
BT |
Bismaleimide Triazine |
|
BTAB |
Bumped Tape-Automated Bonding |
|
C&E |
Cause and Effect |
|
C3 |
Command,Control And Communicate |
|
C4 |
Controlled Collapse Component Connection |
|
CAD |
Computer-Aided Design |
|
CAE |
Computer-Aided Engineering |
|
CAF |
Cathotic Anionic Filaments |
|
CAFM |
Computer-Aided Facilities Management |
|
CAGE |
Commercial and Government Entity |
|
CALS |
Computer-aided Acquisition and Logistic Support |
|
CAM |
Computer-Aided Manufacturing |
|
CAPP |
Computer-Aided Process Planning |
|
CAR |
Computer-Aided Repair |
|
CASE |
Computer-Aided Software Engineering |
|
CAT |
Computer-Aided Testing |
|
CBGA |
Ceramic Ball Grid Array |
|
CCAPS |
Circuit Card Assembly And Processing System |
|
CDA |
Copper Development Association Inc. |
|
CEPM |
Certified Ems Program Managers |
|
CET |
Certified Electronic Technician |
|
CFM |
Cubic Feet per Minute |
|
CFM |
Continuous Flow Manufacturing |
|
CIM |
computer-integrated manufacturing |
|
CISC |
Complex Instruction Set Computing |
|
CITIS |
Contractor Integrated Technical Information Service |
|
CM |
Contract Manufacturer |
|
CMC |
Copper Moly Copper |
|
CMOS |
cargo movement operations system; complimentary metal-oxide semiconductor |
|
CNC |
Computer Numerical Control |
|
COB |
Chip-On-Board |
|
COD |
Consumed Oxygen Demand |
|
COT |
Configure To Order |
|
CP |
Capability Performance |
|
CPL |
Capability Performance, Lower |
|
CPLD |
Complex Programmable Logic Device |
|
CPU |
Central Processing Unit |
|
CPU |
Capability Performance Upper |
|
CRC |
ContrĂ´le de Redondance Cyclique (French: Cyclic Redundancy Check) |
|
CRT |
Cathode Ray Tube (type of TV) |
|
CSA |
Canadian Standards Agency |
|
CSG |
Constructive Solids Geometry |
|
CSP |
Chip Scale Package |
|
CTE |
Coefficient of Thermal Expansion |
|
CVS |
Cyclic Voltammetry Stripping |
|
DAB |
Designated Audit Body |
|
DATC |
Design Automation Technical Committee (IEEE) |
|
DBMS |
Database Management System |
|
DC |
Direct Current |
|
DCAS |
Defense Contract Administration Services |
|
DCMA |
Defense Contract Management Agency |
|
DCMC |
Defense Contract Management Command |
|
DESC |
Defense Electronics Supply Center |
|
DFM |
Design For Manufacture |
|
DIM |
Data-Information Record |
|
DIN |
Deutsches Institute for Normung |
|
DIP |
Dual-Inline Package |
|
Dk |
Dielectric Constant |
|
DLA |
U.S. Defense Logistics Agency |
|
DMA |
direct memory access (computer term) |
|
DMS |
Dynamic Mechanical Spectroscopy |
|
DMSA |
Defense Manufacturers And Suppliers Association |
|
DNC |
Distributed Numerical Control |
|
DOD |
United States Department of Defense |
|
DOD |
Dissolved Oxygen Demand |
|
DOE |
Design Of Experiment |
|
DOS |
Disc Operating System |
|
DRC |
Design Rule Check |
|
DRM |
Drawing Requirements Manual |
|
DS |
Double-Sided |
|
DSC |
Differential Scanning Calorimetry |
|
DSP |
Digital Signal Processor |
|
DTP |
Diameter True Position |
|
DTS |
Dock to Stock |
|
DVM |
Digital Voltmeter |
|
DXF |
Data Exchange Format |
|
ECAD |
Electronic Computer-Aided Design |
|
ECC |
Error Correction Code (Error Checking And Correction) |
|
ECCB |
Electronic Components Certification Board |
|
ECL |
Emitter-Coupled Logic |
|
ECN |
Engineering Change Notice |
|
ECO |
Engineering Change Order |
|
ECR |
Engineering Change Request |
|
ED |
Electrodeposited |
|
EDA |
Electronic Design Automation |
|
EDI |
Electronic Data Interchange |
|
EDIF |
Electronic Design Interchange Format |
|
EDM |
Electro-Discharge Machining |
|
EDO |
Extended Data Output |
|
EIA |
Electronics Industry Association (Adelaide, South Australia, Australia) |
|
EIS |
Engineering Information System |
|
ELD |
Electro-Luminescent Diode |
|
EMC |
Electromagnetic Compatibility |
|
EMF |
Electro-Motive Force |
|
EMP |
Electromagnetic Pulse |
|
EMPF |
Electronics Manufacturing Productivity Facility |
|
EMS |
Electrical Manufacturing Services |
|
ENEPIG |
Electroless Nickel Electroless Palladium Immersion Gold |
|
ENIG |
Electroless Nickel Immersion Gold |
|
ENIPIG |
Electroless Nickel Immersion Palladium Immersion Gold |
|
EPA |
Environmental Protection Agency (US) |
|
EPR |
Ethylene-propylene Resin |
|
EPT |
Ethylene-Propylene Terepolymer |
|
ESD |
Electrostatic Discharge |
|
ESI |
Early Supplier Involvement |
|
ESR |
Equivalent Series Resistance |
|
ETPC |
Electrolytic Tough-Pitch Copper |
|
FAA |
Federal Aviation Administration |
|
FAR |
Failure Analysis Report |
|
FC-CBGA |
Flip Chip Ceramic Ball Grid Array |
|
FC-PBGA |
Flip Chip Platic Ball Grid Array |
|
FCC |
Flat-Conductor Cable |
|
FCC |
Federal Communications Commission (US) |
|
fct |
Functional Circuit Test |
|
FEA |
Finite-Element Analysis |
|
FEM |
Finite-Element Modeling |
|
FEP |
fluorinated ethylene-propylene |
|
FET |
Field Effect Transistor |
|
FFT |
Fast Fourier Transform |
|
FMEA |
Fault Mode And Effect Analysis |
|
FPGA |
Field-Programmable Gate Array |
|
FPT |
Fine-Pitch Technology |
|
FSCM |
Federal Stock Code for Manufacturers |
|
FTP |
File Transfer Protocol |
|
GAAS |
Gallium Arsenide Application Symposium |
|
GBIB |
General Purpose Interface Bus |
|
GMA |
Gas Metal Arc |
|
GTA |
Gas Tungsten Arc |
|
GTPBGA |
Glob Top Plastic Ball Grid Array |
|
hasl |
Hot Air Solder Leveler |
|
HPGL |
Hewlett Packard Graphic Language |
|
HTE |
High Temperature Elongation |
|
HTTP |
Hypertext Transfer Protocol |
|
I/O |
Input/Output |
|
IC |
Integrated Circuit |
|
ICA |
Isotropically Conductive Adhesive |
|
ICAM |
integrated computer-aided manufacturing |
|
ICT |
Inner Circuit Test |
|
IDC |
Insulation-Displacement Connection |
|
IEC |
International Electrotechnical Commission |
|
IECQ |
International Electronic Component Qualification System |
|
IEDR |
Initial Engineering Design Review |
|
IEEE |
Institute of Electrical and Electronic Engineers, Inc. |
|
IEPS |
International Electronic Packaging Society |
|
IGES |
Integrated Graphics Exchange System |
|
ILB |
Inner-Lead Bonding |
|
IP |
Internet Protocol |
|
IPM |
Inches Per Minute |
|
IR |
Infrared |
|
ISCET |
International Society of Certified Electronics Technicians |
|
ISHM |
International Society For Hybrid Microelectronics |
|
ISO |
International Organization for Standardization |
|
ITT |
Inter-Test Time |
|
JEDEC |
Solid State Technology Association |
|
JIT |
Just-In-Time (inventory management) |
|
KGB |
Known Good Board |
|
KGD |
Known Good Die |
|
LAN |
Local Area Network |
|
LBA |
Logical Block Addresses |
|
LCCC |
Leadless Ceramic Chip Carrier |
|
LCD |
Liquid Crystal Display |
|
LDA |
Logic Design Automation |
|
LED |
Light-Emitting Diode |
|
lga |
Lang Grid Array |
|
LIF |
Low Insertion Force |
|
LMC |
Least Material Condition |
|
LPISM |
Liquid Photo-Imageable Solder Mask |
|
LRU |
Lowest Replaceable Unit |
|
LSI |
Large Scale Integration -> VLSI |
|
LTCC |
Low Temperature Co-fired Ceramic |
|
MA |
Mechanical Advantage |
|
MAC |
Media Access Control |
|
MAC |
Maximum Allowable Concentration |
|
MAP |
Manufacturing Automation Protocol |
|
MATS |
Material Transport Segment |
|
MCAD |
Mechanical Computer Aided Design |
|
MCAE |
Mechanical Computer-Aided Engineering |
|
MCM |
multichip module |
|
MDA |
Methylenedianiline |
|
MEK |
Methylethyl Ketone |
|
MELF |
Metal Electrode Face |
|
MIBK |
Methyl-Isobutyl Ketone |
|
MIR |
Moisture Insulation Resistance |
|
MITI |
Ministry of International Trade and Industry |
|
MLB |
Multilayer Board |
|
MLPWB |
Multilayer Printed Wiring Board |
|
MMC |
Maximum Material Condition |
|
MMIC |
Monolithic Microwave Integrated Circuit |
|
MOS |
Model Output Statistics |
|
MRP |
Material Requirement Planning |
|
MRP II |
manufacturing resource planning |
|
MSDS |
Material Safety Data Sheets |
|
MSI |
Medium-Scale Integration |
|
MTBF |
Mean Time Before Failure |
|
MTTR |
Mean Time To Repair |
|
NADCAP |
National Aerospace and Defense Contractors Accreditation Procedures |
|
NASA |
National Aeronautics and Space Administration (US) |
|
NBR |
Nitrile Butadiene-Acrylonitrile Rubber |
|
NBS |
National Bureau of Standards (US) |
|
NC |
Numerical Control |
|
NDT |
Nondestructive Test |
|
NECQ |
National Electronics Component Qualification System |
|
NEMA |
National Electric Manufacturer's Association |
|
NIST |
National Institute For Science And Technology |
|
NMR |
Normal-Mode Rejection |
|
NPI |
New Product Introduction |
|
NSA |
National Security Agency |
|
OA |
Organic Acid |
|
ODR |
Oscillating Disk Rheometer |
|
OEM |
Original Equipment Manufacturer (usually in reference to car parts) |
|
OFHC |
Oxygen-Free High-Conductivity Copper |
|
OLB |
Outer-Lead Bonding |
|
OSHA |
Occupational Safety Hazards Act |
|
OSI |
Open Systems Interconnection (iso Standard) |
|
OSP |
Organic Solder Preservative |
|
P&IA |
Packaging And Interconnecting Assembly |
|
P&IS |
Packaging And Interconnecting Structure |
|
PB |
Printed Board |
|
PBGA |
Plastic Ball Grid Array |
|
PBX |
Private Branch eXchange (company phone system) |
|
PC |
Personal computer (host) |
|
PCA |
Printed Circuit Assembly |
|
PCB |
printed circuit board |
|
PCMCIA |
Personal Computer Memory Card International Association |
|
PDES |
Product Data Exchange Specification |
|
PDL |
Page Description Language |
|
PEM |
Plastic Electronic Module |
|
PGA |
Pin Grid Array |
|
Phigs |
Programmer's Hierarchical Interface Graphics Standard |
|
PID |
Photo-Imageable Dielectric |
|
PIP |
Pin-In-Paste Technology |
|
PLCC |
Plastic Leaded Chip Carrier (electronics) |
|
PLD |
Programmable Logic Device |
|
Pp |
Process Performance |
|
ppm |
parts per million |
|
PPO |
PolyPhenylene Oxide |
|
PPS |
Polyphenylene Sulfide |
|
PRT |
Planar Resistor Technology |
|
PSI |
Pounds Per Square Inch (Static Pressure) |
|
PT |
Positional tolerance |
|
PTFE |
Polytetrafluoroethylene |
|
PTH |
Plated-Through Hole |
|
PVC |
Polyvinyl Chloride |
|
PVT |
Production Validation Test |
|
PWA |
Printed Wiring Assembly |
|
QFP |
Quad Flatpack Package |
|
QML |
Qualified Manufacturer's List |
|
QPL |
qualified products list |
|
QTA |
Quick Turn Around |
|
R |
Rosin |
|
R&R |
Repeatability and Reproducibility |
|
RA |
Rosin-Activated |
|
RAM |
random-access memory |
|
RETMA |
Radio Electronics & Television Manufacturers Association |
|
RFI |
Radio-Frequency Interference |
|
RFP |
Request For Proposal |
|
RFQ |
Request For Quote |
|
RFS |
Regardless of Feature Size |
|
RISC |
Reduced Instruction Set Computing |
|
RMA |
Rosin Mildy Activated |
|
rms |
root mean square (preferred over "RMS") |
|
ROM |
Rough Order of Magnitude |
|
ROM |
Read-Only Memory |
|
RPM |
Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know |
|
RPM |
Revolutions Per Minute, (Rotations Per Minute) |
|
RSS |
Ramp Soak Spike |
|
RTS |
Ramp To Spike |
|
RTV |
Room Temperature Vulcanizer |
|
RwoH |
Reliability Without Hermeticity |
|
SAE |
Society of Automotive Engineers |
|
SBU |
Sequential Buildup |
|
sec |
Solvent Extract Conductivity |
|
SEM |
standard electronic module |
|
sem |
Scanning Electron Microscopes |
|
SERA |
Sequential Electrochemical Reduction Analysis |
|
SFM |
Surface Feet per Minute |
|
SIP |
Single Inline Package |
|
SIR |
Surface Insulation Resistance |
|
SMD |
Surface Mount Device |
|
SMEMA |
Surface Mount Equipment Manufacturers Association |
|
SMOBC |
Solder Mask Over Bare Copper |
|
SMT |
Surface Mounting Technology |
|
SMTA |
Surface Mount Technology Association |
|
SOIC |
Small-Outline Integrated Circuit |
|
SOS |
Silicon-On-Sapphire |
|
SPC |
Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM. |
|
SPICE |
Simulation Program Integrated Circuit Emphasis |
|
SQC |
Statistical Quality Control |
|
SQL |
Structured Query Language |
|
SSI |
Small-Scale Integration |
|
STEP |
Standard For Exchange Of Product Model Data |
|
T&C |
Terms & Conditions |
|
TAB |
Tape-Automated Bonding |
|
TCE |
Thermal Coefficient of Expansion |
|
TCR |
Temperature Coefficient of Resistance |
|
TDR |
Time-Domain Reflectometry |
|
TFA |
Tree-Based Floorplanning Algorithm |
|
TFE |
Tetrafluoroethylene |
|
TG |
Glass Transition Temperature |
|
TGA |
Thermo Gravimetric Analysis |
|
THT |
Through-Hole Technology |
|
TIFF |
Tag Image File Format |
|
TMA |
Thermo Mechanical Analysis |
|
To |
Transistor Outline |
|
TOP |
Technical And Office Protocol |
|
TP |
True Position |
|
TQM |
Total Quality Management |
|
TTL |
Transistor-Transistor Logic |
|
UBM |
Under Bump Metallization |
|
UHF |
Ultrahigh Frequency |
|
ULSI |
Ultra-Large Scale Integration |
|
Uph |
Unit Per Hour |
|
URL |
Universal Resource Locator |
|