What does BONTEC mean?
BONTEC means Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections
This acronym/slang usually belongs to Undefined category.
What is the abbreviation for Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections?
Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections can be abbreviated as BONTEC
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Most popular questions people look for before coming to this page
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What does BONTEC stand for? BONTEC stands for "Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections". |
Q: A: |
How to abbreviate "Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections"? "Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections" can be abbreviated as BONTEC. |
Q: A: |
What is the meaning of BONTEC abbreviation? The meaning of BONTEC abbreviation is "Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections". |
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What is BONTEC abbreviation? One of the definitions of BONTEC is "Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections". |
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What does BONTEC mean? BONTEC as abbreviation means "Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections". |
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What is shorthand of Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections? The most common shorthand of "Bonding Technology for monolithic integration of GASS Optoelectronic devices on SI substrates for Chip-To-Chip optical interconnections" is BONTEC. |
Abbreviations or Slang with similar meaning
- IBCAR - Integration of Buried Capacitors and Resistors in Ceramic Substrates
- MONOFAST - Monolithic Integration beyond 26.5 GHz
- NODES - Nonlinear and Active Optical Devices on Electronic Substrates
- iPOT - Integration of Persons, Organization and Technology
- ISEAT - Integration of Software Engineering and Agent Technology
- OLIVES - Optical Interconnections for VLSI and Electronic Systems
- ADENG - Adhesive bonding technology for Engineering applications
- AIR INSTRUCT - Integration of Advanced ventilated buildingcomponents and Structures for Reduction of energy Consumption in buildings
- BRUCM - Bonding Requirements for Underground Coal Mines
- GOOD - Group of Organic Optoelectronic Devices
- IDEALS - Integration of Dedicated for Advanced training Linked to Small and medium enterprises and institutes of higher education
- INTERCAT - Integration of SME stock catalogues with internet company directories to enable electronic commerce
- MACROTEC - Integration of macroeconomic and S&T policies for growth, employment and technology
- MACROTEC - Integration of MACROeconomic and S&T Policies for Growth, Enployment and TECHnology
- PHIDIAS - Technology for manufacturing of medical models based on rapid Prototyping and medical Imaging technique: quality Assessment and Application development
- TACOTA - Technology for Agile Coherent Optical Transmission Architecture
- TIDE - Technology for the Integration of the Disabled and Elderly
- tops - Technology for Optical Pixel Streaming
- APTAAM - Advanced Processor Technology for Air to Air Missiles
- ASTAAM - Advanced Seeker Technology for Air to Air Missiles